MediaTek has unveiled its new Dimensity 700 5G smartphone chipset. It is a 7nm SoC designed to bring advanced 5G capabilities and experiences to the mass market.
“With our expanded Dimensity portfolio we’re bringing the latest 5G capabilities to every smartphone tier so more people can enjoy 5G experiences,” MediaTek wireless communications business unit corporate vice president and general manager Dr. JC Hsu stated. “The Dimensity 700 has an impressive mix of 5G connectivity features, advanced camera capabilities like night shot enhancements and multiple voice assistant support, all in a super power-efficient design.”
Among the advanced connectivity features of the Dimensity 700 packs are 5G Carrier Aggregation (2CC 5G-CA) and 5G dual SIM dual standby (DSDS), which give users access to the fastest speeds, and 5G-exclusive Voice over New Radio (VoNR) services from either connection. On the processing power side, the chip integrates two Arm Cortex-A76 big cores in its octa-core CPU and operates at up to 2.2GHz.
The Dimensity 700 continues MediaTek’s legacy of bring advanced connectivity, multimedia and imaging features to consumers everywhere. MediaTek’s Dimensity 5G family of chips bring smart and fast together to power 5G devices across all tiers and with the Dimensity 700 5G devices will now be accessible to even more consumers.
The addition of the Dimensity 700 to MediaTek’s Dimensity family of 5G chips gives device makers a full suite of options for 5G smartphone models from flagship and premium to mid-range and mass market devices, making 5G more accessible for consumers everywhere. For full specifications and further details on MediaTek’s Dimensity 700 series and 5G portfolio visit MediaTek.